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The 64-bit correlator masks were completed and fabrication begun. The dual 128-bit discretionary wired design was completed. A comparison of yields between this discretionary design and the fixed interconnected 64-bit design favor...
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The 64-bit correlator masks were completed and fabrication begun. The dual 128-bit discretionary wired design was completed. A comparison of yields between this discretionary design and the fixed interconnected 64-bit design favor the latter with respect to producibility. Therefore, negotiations were conducted to modify the contract to deliver 64-bit modules. (Author)
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Sidegating effects relevant to GaAs digital, analog, and monolithic microwave integrated circuits have been significantly reduced or eliminated by using a new low-temperature buffer layer grown by molecular-beam epitaxy. At radio ...
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Sidegating effects relevant to GaAs digital, analog, and monolithic microwave integrated circuits have been significantly reduced or eliminated by using a new low-temperature buffer layer grown by molecular-beam epitaxy. At radio frequencies the low-temperature buffer layer reduced the signal coupling between devices, which is an important consideration in microwave integrated circuits. For digital circuit applications, the low-temperature buffer layer eliminated the dependence of the voltage level of an inverter on the logic state of adjacent devices and on the duty cycle of a pulse train encountered in the circuit. The highly resistive nature of the low-temperature buffer enables us to experimentally identify the role that a buffer layer plays in sidegating.
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This paper describes the initial design of a comprehensive hierarchical integrated circuit design system, that is currently being implemented at Stanford University. This system encourages the use of structured hardware design tec...
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This paper describes the initial design of a comprehensive hierarchical integrated circuit design system, that is currently being implemented at Stanford University. This system encourages the use of structured hardware design techniques. It is intended for the design and layout of large-scale integrated circuits by means of a combination of manual and algorithmic techniques. (Author)
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This report is an update of one issued in 1977 which predicted that the predicted death of analog circuitry (also called linear) would not occur; in fact, the patient appeared remarkably healthy. The report proved correct. We have...
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This report is an update of one issued in 1977 which predicted that the predicted death of analog circuitry (also called linear) would not occur; in fact, the patient appeared remarkably healthy. The report proved correct. We have the same situation again today: the same predictions and counter-prediction. Each year brings significant advances in the field of analog integrated circuitry. Many of the traditional arguments against analog circuitry are no longer valid. This report attempts to summarize what is available now, and what can (and cannot) be done with analog integrated circuits. It defines analog and makes some comparisons with digital. The most common types of analog integrated circuits are then listed and discussed. Lastly, some design and trouble-shooting hints are given, and the state-of-the-art is discussed. (Author)
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This report describes the materials used and the facilities, techniques, and processes which were developed in an effort to fabricate experimental monolithic silicon PNP integrated circuits. The following processes are described: ...
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This report describes the materials used and the facilities, techniques, and processes which were developed in an effort to fabricate experimental monolithic silicon PNP integrated circuits. The following processes are described: thermal polish, N-type phosphorous isolation diffusion, N-type antimony base and resistor diffusion, N+ phosphorous contact diffusion, P-type boron emitter, guard ring and collector contact diffusion, photolithography, microphotography, aluminum metalizing, chip mounting, and nail-head thennocompression bonding.
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The application of silicon integrated circuits to drivers for microwave latching phase shifters and on the array control logic is being investigated. Two monolithic integrated circuits, a P-MOS circuit for logic and a bipolar circ...
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The application of silicon integrated circuits to drivers for microwave latching phase shifters and on the array control logic is being investigated. Two monolithic integrated circuits, a P-MOS circuit for logic and a bipolar circuit for the analog driver have been designed and fabricated. The output drive circuit is capable of delivering a bidirectional current pulse of up to 5amps through a latching ferrite element. Circuit performance has been excellent for both integrated circuits in the evaluation to date. (Author)
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The 64-bit correlator is in the fabrication phase. The primary yield problems have been solved and completely functional correlators tested. Negotiations were completed to modify the hardware deliverables to forty 64-bit correlators. (Author)
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Concurrently with the 64 bit epitaxial correlator development, a 64 bit triple diffused correlator was developed. Testing shows this latter design to be functional and producible at reasonable yields. Circuits are being fabricated...
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Concurrently with the 64 bit epitaxial correlator development, a 64 bit triple diffused correlator was developed. Testing shows this latter design to be functional and producible at reasonable yields. Circuits are being fabricated and tested. (Author)
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